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Halar ® ECTFE provides excellent chemical
resistance, good electrical properties, a broad-use temperature
range from cryogenic to 300°F (150°C), and meets the
requirements of UL-94 V-0 vertical flame test in thicknesses as
low as 7 mils (0.18 mm). It is a tough material with excellent
impact strength and wear resistance. Halar® 300 resin.
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Applications
for ECTFE (Halar®) Film:
•
Filters
•
Diaphragms
•
Release films
•
Cable insulation
•
Solar collector panels
•
Coaxial and fiber optic wrap film
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Medical bags |
Advantages of ECTFE (Halar®)
Film:
•
Excellent purity
•
Excellent chemical resistance
•
Low permeability
•
Excellent abrasion resistance
•
Excellent temperature resistance
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Also available as mini-cord
(Weldable, mini sizes- 1/16" to 1/4" Diameter)
Click Here
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GENERAL INFORMATION:
Adhesive Bonding:
ECTFE (Halar®)
can be adhesive laminated to variety of plastic
film and
metal substrates
with bond strengths ranging from 52-800 psi and under
harsh chemical
environments. Epoxy adhesives are useful for bonding ECTFE
Halar. The
strength of the bond can be greatly increased if the surface is
first
etched with
sodium, flame treated, plasma, or fluorine gas treated.
Adhesive
System |
Untreated Surface |
Sodium Etched (1) |
Flame Treated
c2> |
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Scotch-Weld® |
52 psi |
>6200)
psi |
>620(4)
psi |
|
#2214 Hi-Temp(3)
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Scotch-Weld° #2216 |
55 psi |
337 psi |
6200)
psi |
BONDiT®
B-45 TH |
150 psi |
800 psi |
800 psi |
Lap shear
strength, HALAR® resin/HALAR resin joint,
3/4'
x 1" joint area.
1. Etchant and
procedure identical to that commonly used on PTFE. Specific
etchant used was Tetra-Etch supplied by W.L. Gore Co. Etching
time was 1-2 minutes.
2. Brushed with propane torch for 15-30
seconds. (Let tip of
flame touch the surface. Move flame just rapidly enough to avoid
charring and/or warping).
3. Rated good for 300°F (149°C) continuous service temperature
by its vendor.
4. Exceeded the yield strength of the 90-mil HALAR® resin used
in the joint.
Thermoforming
ECTFE (Halar®):
Typical thermoforming equipment utilizes infrared
heating sources or convection ovens. Heat the film until it
becomes transparent. Exact temperatures for convection ovens
vary: a starting point is 530°F. Immediately apply vacuum
pressure to the film. Hold the film in place until completely
cooled. Some shapes may require heating of the mold or tools to
prevent cracking or tearing of the film.
Heating requirements are considerably lower for
pressure forming. A temperature range of 300°F to 375°F is a
good starting range. The mass, heat capacity and temperature of
the molds have a great effect on temperature requirements. Form
the film and hold in place until cool.
Permeability To Gases:
Low permeability to water vapor and various other gases.
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Gases
|
cc-mils/100 in2/24
hrs-atm |
|
CO2 |
25
|
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Nitrogen
|
3 |
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Oxygen
|
6
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Water
Vapor |
0.15
(g-mil) |
Heat
Sealing:
ECTFE
(Halar®)
film can be sealed by thermal impulse, rotary band & hot
bar. Approximate hot bar sealing conditions=475F to 500F with
1-2 seconds.
Data Sheet - Halar®
Film
|
Typical Properties |
Test Method |
US Unit |
SI Unit |
|
Physical Properties |
|
Density @ 23C/73°F |
ASTM D792 |
lb/ft3 |
105 |
g/cm3 |
1.68 |
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Water Absorption |
ASTM D570 |
% |
<0.1 |
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Melt Flow Index @ 275°C,
2.16kg |
ASTM D1238 |
g/10 min |
18 |
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Mechanical Properties |
|
Tensile |
ASTM D638
23C/73F
2in/min (50mm/min) |
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Tensile Yield Strength |
psi |
4300 |
MPa |
30 |
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Tensile Break Strength |
psi |
6800 |
MPa |
47 |
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Elongation at Yield |
% |
5 |
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Elongation at Break |
% |
250 |
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Tensile Modulus |
psi |
240,000 |
MPa |
1655 |
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Flexural |
ASTM D790
23C/73F
0.1in/min (2.5mm/min) |
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Flexural Strength |
psi |
6800 |
MPa |
47 |
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Flexural Modulus |
psi |
245,000 |
MPa |
1690 |
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Impact |
ASTM D256
0.125 in (3.2 mm) |
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Notched Izod Strength,
23°C/73°F |
ft.lbf/in |
No Break |
J/m |
No Break |
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Notched Izod Strength,
-40°C/-40°F |
ft.lbf/in |
2.0 |
J/m |
207 |
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Hardness, Shore D |
ASTM D2240 |
|
75 |
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Hardness, Rockwell R |
ASTM D785 |
|
90 |
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Abrasion Resistance, CS
17 (0.5kg) |
Taber |
|
|
mg/1000 rev |
5 |
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Friction Coefficient |
ASTM D1894 |
|
|
|
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Static |
|
0.2 |
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Dynamic |
|
0.2 |
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Thermal
Properties |
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Melting Point |
DSC |
°F |
468 |
°C |
242 |
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Heat of Fusion |
|
BTU/lb |
18 |
J/g |
42 |
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Crystallization Point |
|
°F |
432 |
°C |
222 |
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Crystallization Heat |
|
BTU/lb |
17 |
J/g |
40 |
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Specific Heat @ 23°C/73°F |
|
BTU/lb-°F |
0.23 |
J/g.K |
0.95 |
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DTUL, 66 psi (0.46 MPa) |
ASTM D648 |
°F |
195 |
°C |
90 |
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DTUL 264 PSI (1.82 MPa) |
ASTM D648 |
°F |
150 |
°C |
65 |
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Glass Transition Temperature
(Tg) |
DMA |
°F |
185 |
°C |
85 |
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Brittleness Temperature |
ASTM D746A |
°F |
<-105 |
°C |
<-76 |
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Mold Shrinkage |
ASTM 955 |
% |
2.5 |
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Thermal Stability, 1% Mass
Loss, N2 |
TGA |
°F |
760 |
°C |
405 |
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Linear Thermal Exp.
Coefficient |
ASTM D696 |
10-6/°F |
56 |
10-6/K |
100 |
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Thermal Conductivity @
40°C/104°F |
ASTM C177 |
BTU-in/h-ft2-°F |
1.05 |
W/m.K |
0.15 |
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Electrical Properties |
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Volume Resistivity @ 23°C,
50% RH |
ASTM D257 |
ohm-in. |
1.4X1016 |
ohm.cm |
5.5x1016 |
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Dielectric Strength @
23°C/73°F @ 3.2mm Thickness |
ASTM D149 |
V/mil |
350 |
kV/mm |
14 |
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Dielectric Constant, 23°C @
106 Hz |
|
|
2.57 |
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Fire
Resistance |
|
UL-94 Flammability Test |
UL-94 |
Class |
V-0 |
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Limiting Oxygen Index |
ASTM D2863 |
% |
52 |
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