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Halar Film - CS Hyde Company

ECTFE Halar® Film

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Halar ® ECTFE provides excellent chemical resistance, good electrical properties, a broad-use temperature range from cryogenic to 300°F (150°C), and meets the requirements of UL-94 V-0 vertical flame test in thicknesses as low as 7 mils (0.18 mm). It is a tough material with excellent impact strength and wear resistance. Halar® 300 resin. 

Applications for  ECTFE (Halar®) Film:

• Filters

• Diaphragms

Release films 

Cable insulation

• Solar collector panels

• Coaxial and fiber optic wrap film 

• Medical bags

Advantages of ECTFE (Halar®) Film:

•  Excellent purity

•  Excellent chemical resistance

•  Low permeability

•  Excellent abrasion resistance

•  Excellent temperature resistance

 

 

Also available as mini-cord  (Weldable, mini sizes- 1/16" to 1/4" Diameter)
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Halar Mini-cord - CS Hyde Company

 

GENERAL INFORMATION:

 

Adhesive Bonding:

 

ECTFE (Halar®)  can be adhesive laminated to variety of plastic film and

metal substrates with bond strengths ranging from 52-800 psi and under

harsh chemical environments.  Epoxy adhesives are useful for bonding ECTFE

Halar. The strength of the bond can be greatly increased if the surface is first

etched with sodium, flame treated, plasma, or fluorine gas treated.

 

 

Adhesive
System
Untreated Surface Sodium Etched (1) Flame Treated c2>
Scotch-Weld® 52 psi >6200) psi >620(4) psi
#2214 Hi-Temp(3)      
Scotch-Weld° #2216 55 psi 337 psi 6200) psi
BONDiT®
B-45 TH
150 psi 800 psi 800 psi

Lap shear strength, HALAR® resin/HALAR resin joint, 3/4' x 1" joint area.

1. Etchant and procedure identical to that commonly used on PTFE. Specific etchant used was Tetra-Etch supplied by W.L. Gore Co. Etching time was 1-2 minutes.
2. Brushed with propane torch for 15-30
seconds. (Let tip of flame touch the surface. Move flame just rapidly enough to avoid charring and/or warping).
3. Rated good for 300°F (149°C) continuous service temperature by its vendor.
4. Exceeded the yield strength of the 90-mil HALAR® resin used in the joint.

Thermoforming ECTFE (Halar®): Typical thermoforming equipment utilizes infrared heating sources or convection ovens. Heat the film until it becomes transparent. Exact temperatures for convection ovens vary: a starting point is 530°F. Immediately apply vacuum pressure to the film. Hold the film in place until completely cooled. Some shapes may require heating of the mold or tools to prevent cracking or tearing of the film.

Heating requirements are considerably lower for pressure forming. A temperature range of 300°F to 375°F is a good starting range. The mass, heat capacity and temperature of the molds have a great effect on temperature requirements. Form the film and hold in place until cool.

Permeability To Gases:    Low permeability to water vapor and various other gases.

Gases cc-mils/100 in2/24 hrs-atm
CO2 25
Nitrogen 3
Oxygen 6
Water Vapor 0.15 (g-mil)

Heat Sealing   ECTFE (Halar®) film can be sealed by thermal impulse, rotary band & hot bar.  Approximate hot bar sealing conditions=475F to 500F with 1-2 seconds.

Data Sheet - Halar® Film

Typical Properties Test Method US Unit SI Unit

Physical Properties

Density @ 23C/73°F ASTM D792 lb/ft3 105 g/cm3 1.68
Water Absorption ASTM D570 % <0.1    
Melt Flow Index @ 275°C, 2.16kg ASTM D1238 g/10 min 18    

Mechanical Properties

Tensile ASTM D638

23C/73F
2in/min (50mm/min)

       
Tensile Yield Strength psi 4300 MPa 30
Tensile Break Strength psi 6800 MPa 47
Elongation at Yield % 5    
Elongation at Break % 250    
Tensile Modulus psi 240,000 MPa 1655
Flexural ASTM D790

23C/73F
0.1in/min (2.5mm/min)

       
Flexural Strength psi 6800 MPa 47
Flexural Modulus psi 245,000 MPa 1690
Impact ASTM D256

0.125 in (3.2 mm)

       
Notched Izod Strength, 23°C/73°F ft.lbf/in No Break J/m No Break
Notched Izod Strength, -40°C/-40°F ft.lbf/in 2.0 J/m 207
Hardness, Shore D ASTM D2240   75    
Hardness, Rockwell R ASTM D785   90    
Abrasion Resistance, CS 17 (0.5kg) Taber     mg/1000 rev 5
Friction Coefficient ASTM D1894        
Static   0.2    
Dynamic   0.2    

Thermal Properties

Melting Point DSC °F 468 °C 242
Heat of Fusion   BTU/lb 18 J/g 42
Crystallization Point   °F 432 °C 222
Crystallization Heat   BTU/lb 17 J/g 40
Specific Heat @ 23°C/73°F   BTU/lb-°F 0.23 J/g.K 0.95
DTUL, 66 psi (0.46 MPa) ASTM D648 °F 195 °C 90
DTUL 264 PSI (1.82 MPa) ASTM D648 °F 150 °C 65
Glass Transition Temperature (Tg) DMA °F 185 °C 85
Brittleness Temperature ASTM D746A °F <-105 °C <-76
Mold Shrinkage ASTM 955 % 2.5    
Thermal Stability, 1% Mass Loss, N2 TGA °F 760 °C 405
Linear Thermal Exp. Coefficient ASTM D696 10-6/°F 56 10-6/K 100
Thermal Conductivity @ 40°C/104°F ASTM C177 BTU-in/h-ft2-°F 1.05 W/m.K 0.15

Electrical Properties

Volume Resistivity @ 23°C, 50% RH ASTM D257 ohm-in. 1.4X1016 ohm.cm 5.5x1016
Dielectric Strength @ 23°C/73°F @ 3.2mm Thickness ASTM D149 V/mil 350 kV/mm 14
Dielectric Constant, 23°C @ 106 Hz     2.57    

Fire Resistance

UL-94 Flammability Test UL-94 Class V-0    
Limiting Oxygen Index ASTM D2863 % 52    

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1351 N Milwaukee Avenue, Lake Villa, Illinois 60046
Phone: 800-461-4161 / 847-395-0325
Fax: 800-441-8063


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