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High Temperature Solid
Silicone Sheet
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Product Description:
High
Temperature silicone sheeting is designed to be used in
applications where very extreme temperature resistance is
required for extended periods of time. Silicone exhibits a wish
list of characteristics including superb chemical resistance,
high temperature performance, good thermal and electrical
resistance, long-term resiliency, and easy fabrication. It also
possesses excellent UV and ozone resistance. Silicone is
odorless, tasteless, chemically inert and non-toxic. It offers
low compression set and fungus resistance.
Common Applications:
Silicone
rubber can be used for insulating and cushioning electronic
assemblies. It is also used for gaskets, automotive seals and
hoses, shaft sealing rings, spark plug caps, vibration and sound
damping, industrial rollers, press pads, thermal shielding, heat
sealing and packaging and grommets.
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Typical Properties - Solid Silicone - High
Temperature
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Property |
Test Method |
Silicone Rubber |
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Specific Gravity, G/CC |
ASTM
D297 |
1.45 |
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Durometer, Shore A |
ASTM
D2240 |
60
+/- 5 |
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Tensile Strength, psi |
ASTM
D412 |
1000 |
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Elongation, % |
ASTM
D412 |
350 |
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Tear, psi Die “B” |
ASTM
D624 |
70 |
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Temperature Range |
ºF |
Up
to 600 |
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Heat
age 168hrs. @ 600ºF |
Shore A points change |
+29 |
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Tensile % change |
-56 |
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Elongation % change |
-89 |
Back To
Solid Silicone Sheet
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CS Hyde Company, Inc.
1351 N Milwaukee Avenue, Lake Villa, Illinois 60046
Phone: 800-461-4161 / 847-395-0325
Fax: 800-441-8063 |

©Copyright 2006 CS Hyde Company. All rights reserved. |
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Rulon®, Strip-N-Stick are
registered trademarks of Saint GoBain Performance Plastics Corporation,
Solef®
is a registered
trademarks of Solvay Solexis
C4-NGen® and PVDFStick
are registered trade
names of CS Hyde Company,
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is a
registered trademarks of
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is a
registered trademarks of BASF Corporation, TPX®
is a registered
trademark of Mitsui Chemicals, Inc.
Halar® and Udel®
are registered trademarks of Solvay Solexis, Inc, Mylar®
is a registered
trade name of DuPont Teijin Films. |