The ThermaCool™ family of high performance thermally conductive PSA tapes provide solutions to difficult thermal management problems. These products can be used in place of mechanical fasteners, provide excellent thermal coupling between components and heat sinks and can accommodate materials of different coefficients of thermal expansion with the compliant interface. All of the adhesives are flame retardant and are formulated for high performance adhesion while still being easily re-workable without damage to sensitive components.

Typical Applications

• Bonding heat sinks to ceramic or metal packaged microelectronic components on circuit boards.
• Electrically isolating components while providing good thermal transfer to heat sinks or back planes.
• Providing bonding methods for materials that are supplied without adhesive for ease in assembly.
• Replacing mechanical fasteners with a powerful bonding system that allows rapid assembly.

Products and Description

Polyimide (Kapton®) Based Tapes
Thermally conductive and electrically isolating

K271 - Adhesive on one side, silicone on the other side with a thermally conductive Kapton® MT® base.
K272 - Thermally conductive Kapton® MT® with conductive silicone rubber coating on both sides
K275 - Thermally conductive Kapton® MT® with adhesive on both sides

Metal Foil based Tapes
Thermally conductive metal foil tapes

C675 - Aluminum foil with thermally conductive acrylic adhesive on both sides

Graphite Tapes
Flexible thermally conductive flexible graphite tape

C695 - Graphite Tape with thermally conductive acrylic adhesive on one side

Key Product Properties - Thermally Conductive Tapes K271, K272, K275, C675, C695

• Thermally conductive ceramic filled acrylic adhesive system with integral flame retardant package used on all conductive products (except K272).
• Silicone adhesive system is available for special applications.
• Low thermal impedance and good thermal conductivity provides superior heat transfer performance.
• Allows thermal expansion differences between electrical components and dissipation devices to be easily accommodated while maintaining high thermal transfer rates.
• Provides ease of component assembly and allows rapid re-work.
• Can be easily die cut for simple, low cost application.