Thermal management or excessive heat generation is a common issue found in the electronics industry. With technology advances, new devices have many more electronic components and circuity than in the past. New generation electronic devices now require better thermal management solutions or cooling systems to dissipate heat generation and keep components cool.
Types of thermal cooling systems:
The most common types of cooling systems include heat sinks, auxiliary fans, heat pipes, or liquid cooling systems. However, new compact device designs often face problems placing these cooling systems into tight compartments or enclosures. They sometimes require additional fabrication thus potentially increasing device weight and size. To offer a better solution for these type of situations CS Hyde specializes in material thermal management solutions that can be incorporated in device manufacturing to keep components cool, control operating temperatures, and dissipate heat. Incorporating these materials in your design will help simplify assembly, enhance performance, and most importantly minimize reliability concerns and improve operational device lifetimes that are often affected by heat.
Types of thermal management applications:
EV Battery Technology | PCB Boards | Data Servers/Data Mining Systems | HVAC Systems/Industrial Systems
CS Hyde Thermal Management Solutions
Kapton® (polyimide) can be utilized to control thermal heat in electronic assemblies
DuPont™ Kapton® MT polyimide film is a homogeneous film possessing 3x the thermal conductivity and cut through strength of standard Kapton® HN. Kapton® MT is the same film used in manufacturing of ThermaCool™ Tapes.
Applications include: Insulation pads (heat sink), Heater circuits, Power supplies, Ceramic board replacements
The ThermaCool™ family of high performance thermally conductive PSA tapes provide solutions to difficult thermal management problems. These products can be used in place of mechanical fasteners, provide excellent thermal coupling between components and heat sinks and can accommodate materials of different coefficients of thermal expansion with the compliant interface. ThermaCool™ adhesives are flame retardant and are formulated for high performance adhesion while still being easily re-workable without damage to sensitive components.
Designed for use in thermally conductive gaskets for high performance electronics where low thermal resistance and high dielectric strength are required.
Thermally conductive silicone sheet or tape as heat protection or gap filling solutions
This specialty solid silicone offers thermal conductivity along with electrical isolation for heat transfer between PC boards and heat sinks. Thermally conductive solid silicone is a firm interface material used for applications requiring a heat protectant. These products are designed to remove the heat generated by an electronic device to the ambient environment to ensure the reliable operation of computers, communication equipment or similar electronic hardware. It can also be used for filling air gaps under high load force between PC boards and heat sinks.
Ideal for applications where gaps are >.020 and can accommodate high pressure force of 100 psi
This sponge material offers thermal conductivity along with electrical isolation. It has excellent conformability to irregular surfaces and a clean release from most materials. Its cellular structure provides extremely compliant gap filler.
Designed to fill the needs of an unsupported thermal transfer material in applications requiring clean release, enhanced thermal performance, gap filling, electrical isolation, and vibration cushioning.
Available in multiple thicknesses to fill various air gap heights- 1/32”, 1/16”, 3/32”, 1/8”, 3/16”, 1/4” Thicknesses Available.
A quick conformable thermal gasket solution
512AF Strip-N-Stick Tape offers the compressibility of a modified cell silicone fire blocking foam with a PET film-supported acrylic adhesive on one side. Its instant low compression set makes its ideal for gasket applications that require a more conformable gap filling solution.